Quality Control

Your Global Partner,In Seourcing Electronic Components,Setting the quality standard in electronic components distribution.

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Quality is greater than life
We are well aware that inferior raw materials will bring heavy losses to production-oriented enterprises, not only money, but also time. The chaos in the electronic components industry is long-time existing. In order to obtain high profits, illegal vendors often supply inferior products.
Facing the chaos in the industry, Chang Ming has formulated a thorough quality inspection process. We selects original factories or authorized agents worldwide, and select ultra-large-scale OCM, EMS as partners. We control quality from the source with strict quality management processes and cooperate with professional third-party testing institutions to minimize quality risks.

Chang Ming lifetime quality assurance commitment is based on the confidence in quality control, while the confidence in quality control stems from the most stringent supplier selection, quality testing methods and quality testing procedures.
  • Strict Supplier Management Procedure
  • Comprehensive Quality Inspection Procedure
  • Professional 3rd party Electrical Testing
  • Life Time Warranty Commitment
  • ISO9001:2015 Certification Company
Quality Inspection Procedure
  • Packaging Inspection
    Packaging Inspection

    Check outer box of the material whether damaged
    Check outer box of the material whether damaged
    Check vacuum package of the material whether leaking

  • Documents Review
    Documents Review

    Check supplier's packing list whether corresponds to the material
    Check supplier's COC whether corresponds to the material
    Check original COC whether carried as required
    Check agent's PACK LIST whether authorized as required

  • Photo Evidences
    Photo Evidences

    Take photos of outer box
    Take photos of inner packaging
    Take photos of vacuum packaging
    Take photos of label

  • Accuracy measurement
    Accuracy measurement

    Measure the length, width and thickness of the chip whether consistent with the original specifications
    Measure the pin diameter of the chip whether consistent with the original specification
    Measure the chip pin spacing whether consistent with the original specifications
    Measure the width of the braid whether consistent with the original specification

  • Exterior examination
    Exterior examination

    Check the silk screen model whether consistent with the original specification
    Check the silk-screened batch number whether consistent with the label
    Check the silk screen LOT# whether consistent with the label
    Check the overall silk screen whether consistent with GOLDEN SAMPLE
    Check the pins whether have oxidation traces

  • Label confirmation
    Label confirmation

    Confirm the label whether original
    Confirm the label whether complete
    Confirm the model batch on the label whether consistent with the goods
    Confirm the LOT# on the label whether consistent with the goods

  • Requirements verification
    Requirements verification

    Verify the model number whether consistent with the purchase order
    Verify the batch number whether consistent with the purchase order
    Verify the place of origin whether consistent with the purchase order
    Verify the quantity whether consistent with the purchase order
    Verify the terms of special requirements whether consistent with the purchase order

  • Detailed inspections
    Detailed inspections

    X-ray check the binding wire whether has breakpoints
    DE-CAP check the wafer whether consistent with GOLDEN SAMPLE
    High and low temperature test
    Other electrical performance tests

  • Test Pass
    Test Pass

    Test passed materials are deemed to have passed inspections, and go to the next shipping management process

Shipment Management Procedure

Package

Packed in accordance with the MSL requirement of material strictly
MSL 1 Anti-static bag
MSL 2 Desiccant + color card + Moisture Barrier Bag (MBB)
MSL 3 Desiccant + color card + Moisture Barrier Bag (MBB)
MSL 4 Desiccant + color card + Moisture Barrier Bag (MBB)

Label

Attach Chang Ming standard bar code label
Label with customers PN according to customer requirement
Label with customer's LOGO according to customer requirements
Convenient for customers to scan and store

Protection

Each individual small package wrapped in bubble film
Prevent oxidation caused by air leakage during transportation

Boxing

Put a batch of goods into cartons properly according to volume and length, etc.
Fill the vacant with bubble film to prevent logistics accidents

Shipmark

Stick the outer box shipmark
Put the packing list into the PACK LIST bag of the outer box
Make it as convenient as possible for customers to recognize goods quickly

  • 1Package

    Packed in accordance with the MSL requirement of material strictly
    MSL 1 Anti-static bag
    MSL 2 Desiccant + color card + Moisture Barrier Bag (MBB)
    MSL 3 Desiccant + color card + Moisture Barrier Bag (MBB)
    MSL 4 Desiccant + color card + Moisture Barrier Bag (MBB)

  • 2Label

    Attach Chang Ming standard bar code label
    Label with customers PN according to customer requirement
    Label with customer's LOGO according to customer requirements
    Convenient for customers to scan and store

  • 3Protection

    Each individual small package wrapped in bubble film
    Prevent oxidation caused by air leakage during transportation

  • 4Boxing

    Put a batch of goods into cartons properly according to volume and length, etc.
    Fill the vacant with bubble film to prevent logistics accidents

  • 5Shipmark

    Stick the outer box shipmark
    Put the packing list into the PACK LIST bag of the outer box
    Make it as convenient as possible for customers to recognize goods quickly

Professional 3rd party Electrical Testing

KEYENCE JAPAN VHX-7000 4K Ultra-High Accuracy Microscope


Automatically output 3D test report
Ring-shaped light and bottom light
Dust cleanliness detection
Maximum area measurement
Check the pins for copper leakage
Check the surface for sanding marks
Automatic measurement of various areas: shell thickness angle, pin length and width, sphere diameter, etc.
Roughness detection (compare the RA value on the surface of the shell to judge the process consistency, compare the test consistency of the front and back of the shell, compare the smoothness of the pins to judge the degree of oxidation, etc.)
3D automatic stitching, on the basis of 2D stitching, the depth of field synthesis function is added to compare whether the process of the front and back of the chip is the same.

SEAMARK X5600 X-RAY


Check whether the internal frame of the chip conforms to the original data to prevent counterfeit products
Check whether the internal leads of the chip conform to the original data to prevent short circuit of the chip
Check whether there are air bubbles inside the chip to prevent quality problems in the chip.